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Fabrication techniques of electrode arrays for carbon nanotubes


Belarusian State University of Informatics and Radioelectronics, P. Brovki str. 6, Minsk, 220013, Belarus

Techniques for fabricating electrode arrays for carbon nanotubes used as structural elements of various nanoelectronic devices are reviewed. Ways of reducing electrode resistivity and contact resistance in metal — carbon nanotube structures are examined. Advances in and prospects for using nanotubes as interlevel contact junctions in IC multilevel metallization systems are discussed.

Fulltext is available at IOP
PACS: 73.63.Fg, 85.35.Kt, 85.40.−e (all)
DOI: 10.3367/UFNe.0179.200903b.0243
URL: https://ufn.ru/en/articles/2009/3/b/
Citation: Vorob’eva A I "Fabrication techniques of electrode arrays for carbon nanotubes" Phys. Usp. 52 225–234 (2009)
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Оригинал: Воробьева А И «Электродные системы к углеродным нанотрубкам и методы их изготовления» УФН 179 243–253 (2009); DOI: 10.3367/UFNr.0179.200903b.0243

References (53) ↓ Cited by (2) Similar articles (2)

  1. Li J et al. Appl. Phys. Lett. 75 367 (1999)
  2. Eletskii A V Usp. Fiz. Nauk 172 401 (2002); Eletskii A V Phys. Usp. 45 369 (2002)
  3. Jung H Y et al. Appl. Phys. Lett. 90 153114 (2007)
  4. Kim S J Pis’ma ZhTF 31 (14) 34 (2005); Kim S J Tech. Phys. Lett. 31 597 (2005)
  5. Novikov Yu A, Rakov A V, Todua P A Trudy IOFAN Im. A.M. Prokhorova 62 3 (2006)
  6. Endo M et al. Carbon 33 873 (1995)
  7. Sinnott S B et al. Chem. Phys. Lett. 315 25 (1999)
  8. Helveg S et al. Nature 427 426 (2004)
  9. Meyyapan M In Encyclopedia Of Nanoscience And Nanotechnology Vol. 1 (Ed. H S Nalwa) (Stevenson Ranch, Calif.: Am. Sci. Publ., 2004) p. 581
  10. Levashov E A i dr. v Sb. Trudov Vtoroi Vseross. Konf. Po Nanomaterialam "NANO 2007" (Novosibirsk, 2007) p. 335
  11. Zhu W G, Kaxiras E Appl. Phys. Lett. 89 243107 (2006)
  12. McEuen P L, Fuhrer M S, Hongkun P IEEE Trans. Nanotechnol. 1 (1) 78 (2002)
  13. Ebbesen T W et al. Nature 382 54 (1996)
  14. Dresselhaus M S, Dresselhaus G, Avouris Ph (Eds) Carbon Nanotubes (Berlin: Springer, 2001)
  15. Wei B Q et al. Appl. Phys. Lett. 79 1172 (2001)
  16. Hashishin T, Tono Y, Tanaki J Jpn. J. Appl. Phys. 45 333 (2006)
  17. Jang W Y et al. Appl. Phys. Lett. 84 1177 (2004)
  18. Anantram M P, Datta S, Xue Y Phys. Rev. B 61 14219 (2000)
  19. Mingo N, Han J Phys. Rev. B 64 201401 (2001)
  20. Nihei M et al. Jpn. J. Appl. Phys. 43 1856 (2004)
  21. Li J et al. Appl. Phys. Lett. 82 2491 (2003)
  22. Rosen R et al. Appl. Phys. Lett. 76 1668 (2000)
  23. Lee R S et al. Nature 388 255 (1997)
  24. Kociak M et al. Phys. Rev. Lett. 86 2416 (2001)
  25. Tang Z K et al. Science 292 2462 (2001)
  26. Takesue I et al. Phys. Rev. Lett. 96 057001 (2006)
  27. Stampfer C et al. Nano Lett. 6 233 (2006)
  28. Dujardin E Appl. Phys. Lett. 87 193107 (2005)
  29. Bauerdick S et al. J. Vacuum Sci. Technol B 24 3144 (2006)
  30. Zhang Y et al. J. Phys. D 39 4878 (2006)
  31. Huang B R et al. J. Appl. Phys. 17 88 (2001)
  32. Won Bong Choi et al. in Carbon Nanotube for Nanoelectronics: Intern. Conf. IEEE-Nano 2003, August 12 - 14, San Francisco, CA, 2003
  33. Lee J-O et al. J. Phys. D 33 1953 (2000)
  34. Kawano T et al. Appl. Phys. Lett. 89 163510 (2006)
  35. Xing Y J et al. Appl. Phys. Lett. 87 263117 (2005)
  36. Erts D et al. J. Phys. Chem. B 110 820 (2006)
  37. Dohn S, Mølhave K, Bøggild P Sensor Lett. 3 300 (2005)
  38. Tarasov M i dr. Pis’ma ZhETF 84 325 (2006); Tarasov M et al. JETP Lett. 84 267 (2006)
  39. Naeemi A, Sarvari R, Meindl J D IEEE Electron Dev. Lett. 26 84 (2005)
  40. White C T, Todorov T N Nature 393 240 (1998)
  41. Nihei M et al. in Proc. IEEE Int. Interconnect Tech. Conf., 2005, Burlingame, CA p. 234
  42. Hjortstam O et al. Appl. Phys. A 78 1175 (2004)
  43. Jun L, Meyya M "Carbon nanotube interconnect" US Patent 7094679 (2006)
  44. Gstrein F et al. "Carbon nanotube interconnect contacts" US Patent 20060281306 (2006)
  45. Pustovalov K Novosti Nauki Tekhnologii (1(4)) (2006)
  46. Srivastava N, Banerjee K Proc. of the 21st Inter. VLSI Multilevel Interconnect Conf. (VMIC), Sept. 29 - Oct. 2 (Waikoloa, HI, 2004) p. 393
  47. Kreupl F et al. Microelectron. Eng. 64 399 (2002)
  48. Graham A P et al. Diamond Relat. Mater. 13 1296 (2004)
  49. Meyyappan M et al. Plasma Sources Sci. Technol. 12 205 (2003)
  50. Vorob’eva A I, Prudnikova E L, Shulitskii B G Nano- Mikrosistemnaya Tekhnika (9) 39 (2007)
  51. Wong V T S, Li W J ISCAS (IEEE Int. Symp. Circuits Systems) 4 844 (2003)
  52. Wei B Q, Vajtai R, Ajayan P M Appl. Phys. Lett. 79 1172 (2001)
  53. Naeemi A, Sarvari R, Meindl J D in Proc. IEEE Int. Interconnect Tech. Conf. San Diego, California, 2006 p. 201

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